Math Solutions

[All Steps] Solder-joint inspections. Current technology uses high resolution X-rays and lasers for inspection of solder-joint defects on printed circuit

Question: Solder-joint inspections. Current technology uses high resolution X-rays and lasers for inspection of solder-joint defects on printed circuit boards (PCBs) (Global SMT & Packaging. April 2008). A particular manufacturer of laser based inspection equipment claims that its product can inspect on average at least 10 solder joints per second when the joints are spaced .1 inch apart. The equipment was tested by a potential buyer on 48 different PCBs. In each case, the equipment was operated for exactly 1 second. The number of solder joints inspected on each run follows (data are saved in the PCB file):

Inspected
10
9
10
10
11
9
12
8
8
9
6
10
7
10
11
9
9
13
9
10
11
10
12
8
9
9
9
7
12
6
9
10
10
8
7
9
11
12
10
0
10
11
12
9
7
9
9
10
  1. The potential buyer wants to know whether the sample data refute the manufacturer's claim. Specify the null and alternative hypotheses that the buyer should test.
  2. In the context of this exercise, what is a Type I error? A Type II error?
  3. Conduct the hypothesis test you described in part a and interpret the test's results in the context of this exercise. Use \(\alpha=.05\)

Price: $2.99
Solution: The downloadable solution consists of 5 pages
Deliverable: Word Document


∴ Other downloads you may be interested in ∴

log in to your account

Forgot password?
Don't have a membership account?
REGISTER

reset password

Back to
log in

sign up

Back to
log in